3D printing technology is a kind of rapid prototyping technology, which is a technology based on mathematical model files, using adhesive materials such as powdered metal or plastic, and constructing objects layer by layer. It is often used in mold manufacturing, industrial design and other fields to manufacture models, and then gradually used in the direct manufacture of some products, and there are already parts printed using this technology. The technology has applications in jewelry, footwear, industrial design, architecture, engineering and construction (AEC), automotive, aerospace, medical industry, education, geographic information systems, civil engineering, firearms, and other fields.

Spectroscopy is a powerful non-contact technique that can quickly identify the composition and associated properties of substances by analyzing changes in absorption or reflection of light at different wavelengths throughout the spectrum. Spectral analysis according to the spectrum of the substance to identify the substance and determine its chemical composition and relative content, according to the principle of analysis, spectrum analysis can be divided into emission spectrum analysis and absorption spectrum analysis two types. Spectral analysis can support visible, IR, or UV wavelengths.

3D detection is a fast and accurate way to collect physical information of objects, through the processing of images and data, you can obtain the length, width, height, volume, feature size, feature position, area and other information of the object.
DLP spatial light modulation technology has many application cases in the medical field, such as: phototherapy laser treatment, ophthalmology, vascular projection, skin measurement, genetic science, etc.

Photolithography is an important step in the semiconductor device manufacturing process that uses exposure and development to characterize the geometric structure on the photoresist layer, and then transfer the pattern on the photomask to the substrate by etching. The substrate here contains not only silicon wafers, but also other metal layers, dielectric layers, such as glass, sapphires in SOS.

Scene infrared simulation can be applied to infrared image analysis research, battlefield environment simulation and infrared weapon testing and many other fields. The image is compressed into a single pixel by compression technology and special coding, and then the image is obtained remotely by the infrared emitting / receiving device, and the captured picture is obtained by decoding.